M-Module USM FPGA Development Kit Mezzanine I/O Products

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Mezzanine I/O  \   Carrier & Eval Boards   \  M-Module USM FPGA Development Kit

M-Module™ USM™ FPGA Development Kit

Technical Data

Evaluation Board AD99

50-pin connection to M199
• SCSI 2 connector
• 46 I/O signals from/to M199

Six SA-Adapter™ slots
• For direct onboard connection
• 46 I/O signals from/to SCSI 2 connector
• RS232 SA-Adapter™ SA1 included

Three 20-pin I/O connectors
• 46 I/O signals from/to SCSI 2 connector

Eight user LEDs at front, driven by I/O signals

M-Module™ M199 (USM™ main module)

CPU
• Nios® II soft processor
• 66MHz

Memory
• 32MB DDR2 SDRAM, soldered
• 8MB non-volatile Flash, for FPGA data and Nios® firmware

I/O at front panel (SCSI 2 connector)
• One LVTTL UART (for RS232 on AD99 via SA1 SA-Adapter™)

Functions in FPGA
• Main bus interface
• Altera® SOPC Unit incl. Nios® II/f soft processor, GPIO, UART and DDR2 SDRAM control
• Wishbone-to-Avalon®/Avalon®-to-Wishbone bridges
• Reset controller, interrupt controller, SMBus controller, GPIO controller
• M-Module™ to Wishbone bridge, ID EEPROM emulation
16Z045_FLASH - Flash interface
The FPGA offers the possibility to add customized I/O functionality. See FPGA.

USM™ Slot
• One slot populated with bare USM™ module US0
• US0 only passes through signals between the FPGA and the front connector and reduces +5V input levels to 3.3V system I/O level

Connection to evaluation board
• SCSI 2 connector, 50-pin HP D-Sub receptacle
• 46 I/O signals from/to evaluation board, FPGA-controlled

M-Module™ Characteristics
• Compliant with M-Module™ standard
• A08, A24, D08, D16, D32, INTA, IDENT

Accessories

SA1 RS232 SA-Adapter™

SCSI 2 cable

Please note that the kit does not include an M-Module™ carrier board! You should install the M-Module™ on a suitable carrier in a test system of your choice.

Electrical Specifications

Supply voltage/power consumption:
• M199 with US0: +5V (-3%/+5%), 1000mA max.
• AD99: +5V, consumption only depends on SA-Adapter™ used, current drawn on I/O lines and LEDs driven, with 1 SA1 and all 8 LEDs on approx. 100mA typ.
• SA1: +5V (-3%/+5%), 40mA typ.

MTBF:
• M-Module™ USM™ Development Kit (total): 319,364h @ 40°C according to IEC/TR 62380 (RDF 2000)
• M199: 533,355h @ 40°C according to IEC/TR 62380 (RDF 2000)
• US0: 1,989,261h @ 40°C according to IEC/TR 62380 (RDF 2000)
• AD99: 1,469,985h @ 40°C according to IEC/TR 62380 (RDF 2000)
• SA1: 1,870,000h @ 50°C (derived from MIL-HDBK-217F)

Mechanical Specifications

Dimensions:
• M199: conforming to M-Module™ standard
• US0: conforming to USM™ standard
• AD99: standard single Eurocard, 100mm x 160mmm
• SA1: 32mm x 42mm

Weight:
• M199: 70g
• US0: 20g
• AD99: 90g
• SA1: 16g

Environmental Specifications

Temperature range (operation):
• 0..+60°C
• Airflow: min. 10m³/h

Temperature range (storage): -40..+85°C

Relative humidity (operation): max. 95% non-condensing

Relative humidity (storage): max. 95% non-condensing

Altitude: -300m to + 3,000m

Shock: 15g/11ms

Bump: 10g/16ms

Vibration (sinusoidal): 2g/10..150Hz

Conformal coating on request

Safety

PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers

EMC

Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)

Software Support

Nios® sample design for Quartus® II development tools

Flash update tools for Windows®, Linux, VxWorks®

Driver software depending on implemented FPGA functions

For more information on supported operating system versions and drivers see Software.

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