M199 - USM™ Main M-Module™

Technical Data

Functionality

User-defined through FPGA

Line drivers and/or additional hardware implemented on USM™ Universal Submodule (not included)

Memory

32MB SDRAM memory
• Soldered
• DDR2
• 133MHz memory bus frequency
• FPGA-controlled

8MB non-volatile Flash
• 2MB for FPGA data
• 6MB for user data or Nios® firmware
• FPGA-controlled

FPGA

Standard factory FPGA configuration:
• Main bus interface
• Altera® SOPC Unit incl. Nios® II/f soft processor, GPIO, UART and DDR2 SDRAM control
• Wishbone-to-Avalon®/Avalon®-to-Wishbone bridges
• Reset controller, interrupt controller, SMBus controller, GPIO controller
• M-Module™ to Wishbone bridge, ID EEPROM emulation
• 16Z045_FLASH - Flash interface

The FPGA offers the possibility to add customized I/O functionality. See FPGA.

USM™ Slot

One slot for a standard USM™ module

For implementation of line drivers and/or additional hardware

Miscellaneous

Eight onboard LEDs at bottom side of board, FPGA-controlled
• One used to show FPGA load status, seven free for user-defined functions (GPIO)

I²C interface to detect the USM™ module

M-Module™ Characteristics

Compliant with M-Module™ standard

The actual characteristics implemented depend on the USM™ module and FPGA function!

Prepared for A08, A24, D08, D16, D32, INTA, INTB, INTC, DMA08, DMA16, DMA32, TRIGI, TRIGO, IDENT

Peripheral Connections

Via front panel on a shielded 50-pin HP D-Sub SCSI 2 receptacle connector

Electrical Specifications

Isolation voltage:
• Voltage depends on implementation and signal routing of USM™
• Voltage between the connector shield and isolated ground is limited to approx. 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor

Supply voltage/power consumption:
• +5V (-3%/+5%), 400mA max. (M199 only), 1000mA max. (M199 with USM™)

MTBF: 533,355h @ 40°C according to IEC/TR 62380 (RDF 2000)

Mechanical Specifications

Dimensions: conforming to M-Module™ standard

Weight: 70g (w/o USM™ module)

Environmental Specifications

Temperature range (operation):
• -40..+85°C (qualified components)
• Airflow: min. 10m³/h

Temperature range (storage): -40..+85°C

Relative humidity (operation): max. 95% non-condensing

Relative humidity (storage): max. 95% non-condensing

Altitude: -300m to + 3,000m

Shock: 15g/11ms

Bump: 10g/16ms

Vibration (sinusoidal): 2g/10..150Hz

Conformal coating on request

Safety

PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers

EMC

Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)

Software Support

Nios® sample design for Quartus® II development tools

Flash update tools for Windows®, Linux, VxWorks®

Driver software depending on implemented FPGA functions

For more information on supported operating system versions and drivers see Software.